Three-dimensional memory device and methods of forming

ABSTRACT

A method for forming a memory device includes: forming a first layer stack and a second layer stack successively over a substrate, wherein each of the first and the second layer stacks comprises a dielectric layer, a channel layer, and a source/drain layer formed successively over the substrate; forming openings that extends through the first layer stack and the second layer stack, where the openings includes first openings within boundaries of the first and the second layer stacks, and a second opening extending from a sidewall of the second layer stack toward the first openings; forming inner spacers by replacing portions of the source/drain layer exposed by the openings with a dielectric material; lining sidewalls of the openings with a ferroelectric material; and forming first gate electrodes in the first openings and a dummy gate electrode in the second opening by filling the openings with an electrically conductive material.

PRIORITY CLAIM AND CROSS-REFERENCE

This application claims the benefit of U.S. Provisional Application No.63/031,713, filed on May 29, 2020, which application is herebyincorporated herein by reference.

TECHNICAL FIELD

The present invention relates generally to semiconductor memory devices,and, in particular embodiments, to three-dimensional memory devices withferroelectric material.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as personal computers, cell phones, digital cameras, and otherelectronic equipment. Semiconductor devices are typically fabricated bysequentially depositing insulating or dielectric layers, conductivelayers, and semiconductor layers of material over a semiconductorsubstrate, and patterning the various material layers using lithographyand etching techniques to form circuit components and elements thereon.

The semiconductor industry continues to improve the integration densityof various electronic components (e.g., transistors, diodes, resistors,capacitors, etc.) by continual reductions in minimum feature size, whichallow more components to be integrated into a given area. However, asthe minimum features sizes are reduced, additional problems arise thatshould be addressed.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawings, in which:

FIG. 1 illustrates a cross-sectional view of a semiconductor device withintegrated memory devices, in an embodiment;

FIGS. 2-9, 10A, 10B, 10D, 10E, 10F, 10G, 10H, 11, and 12 illustratevarious views of a three-dimensional memory device at various stages ofmanufacturing, in an embodiment;

FIG. 10C illustrates switching of the electrical polarization directionof the ferroelectric material of the three-dimensional memory device ofFIG. 10B, in an embodiment;

FIG. 13 illustrates a perspective view of a three-dimensional memorydevice, in another embodiment;

FIG. 14 illustrates a perspective view of a three-dimensional memorydevice, in yet another embodiment;

FIG. 15 illustrates an equivalent circuit diagram of a three-dimensionalmemory device, in an embodiment; and

FIG. 16 illustrates a flow chart of a method of forming a memory device,in some embodiments.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly. Throughout thediscussion herein, unless otherwise specified, the same or similarreference numeral in different figures refers to the same or similarelement formed by a same or similar process using a same or similarmaterial(s).

In some embodiments, a method for forming a memory device includes:forming a first layer stack and a second layer stack successively over asubstrate, wherein each of the first and the second layer stackscomprises a dielectric layer, a channel layer, and a source/drain layerformed successively over the substrate; forming openings that extendsthrough the first layer stack and the second layer stack, where theopenings includes first openings within boundaries of the first and thesecond layer stacks, and a second opening extending from a sidewall ofthe second layer stack toward the first openings; forming inner spacersby replacing portions of the source/drain layer exposed by the openingswith a dielectric material; lining sidewalls of the openings with aferroelectric material; and forming first gate electrodes in the firstopenings and a dummy gate electrode in the second opening by filling theopenings with an electrically conductive material.

FIG. 1 illustrates a cross-sectional view of a semiconductor device 100with integrated memory devices 123 (e.g., 123A and 123B), in anembodiment. The semiconductor device 100 is a fin-field effecttransistor (FinFET) device with three-dimensional (3D) memory devices123 integrated in the back-end-of-line (BEOL) processing ofsemiconductor manufacturing, in the illustrated embodiment. To avoidclutter, details of the 3D memory devices 123 are not shown in FIG. 1,but are discussed hereinafter.

As illustrated in FIG. 1, the semiconductor device 100 includesdifferent regions for forming different types of circuits. For example,the semiconductor device 100 may include a first region 11 o for forminglogic circuits, and may include a second region 120 for forming, e.g.,peripheral circuits, input/output (I/O) circuits, electrostaticdischarge (ESD) circuits, and/or analog circuits. Other regions forforming other types of circuits are possible and are fully intended tobe included within the scope of the present disclosure.

The semiconductor device 100 includes a substrate 101. The substrate 101may be a bulk substrate, such as a silicon substrate, doped or undoped,or an active layer of a semiconductor-on-insulator (SOI) substrate. Thesubstrate 101 may include other semiconductor materials, such asgermanium; a compound semiconductor including silicon carbide, galliumarsenic, gallium phosphide, gallium nitride, indium phosphide, indiumarsenide, and/or indium antimonide; an alloy semiconductor includingSiGe, GaAsP, AlInAs, AlGaAs, GaInAs, GaInP, and/or GaInAsP; orcombinations thereof. Other substrates, such as multi-layered orgradient substrates, may also be used.

Electrical components, such as transistors, resistors, capacitors,inductors, diodes, or the like, are formed in or on the substrate 101 inthe front-end-of-line (FEOL) processing of semiconductor manufacturing.In the example of FIG. 1, semiconductor fins 103 (also referred to asfins) are formed protruding above the substrate 101. Isolation regions105, such as shallow-trench isolation (STI) regions, are formed betweenor around the semiconductor fins 103. Gate electrodes 109 are formedover the semiconductor fins 103. Gate spacers in are formed alongsidewalls of the gate electrodes 109. Source/drain regions 107, such asepitaxial source/drain regions, are formed on opposing sides of the gateelectrodes 109. Contacts 113, such as gate contacts and source/draincontacts, are formed over and electrically coupled to respectiveunderlying electrically conductive features (e.g., gate electrodes 109or source/drain regions 107). One or more dielectric layers 117, such asan inter-layer dielectric (ILD) layer, is formed over the substrate 101and around the semiconductor fins 103 and the gate electrodes 109. Otherelectrically conductive features, such as conductive lines 115, may alsobe formed in the one or more dielectric layers 117. The FinFETs in FIG.1 may be formed by any suitable method known or used in the art, detailsare not repeated here.

Still referring to FIG. 1, a dielectric layer 119, which may be an etchstop layer (ESL), is formed over the one or more dielectric layers 117.In an embodiment, the dielectric layer 119 is formed of silicon nitrideusing plasma-enhanced physical vapor deposition (PECVD), although otherdielectric materials such as nitride, carbide, boride, combinationsthereof, or the like, and alternative techniques of forming thedielectric layer 119, such as low-pressure chemical vapor deposition(LPCVD), PVD, or the like, could alternatively be used. Next, adielectric layer 121 is formed over the dielectric layer 119. Thedielectric layer 121 may be any suitable dielectric material, such assilicon oxide, silicon nitride, or the like, formed by a suitablemethod, such as PVD, CVD, or the like. One or more memory device 123A,each of which includes a plurality of memory cells, are formed in thedielectric layer 121 and coupled to electrically conductive features(e.g., vias 124 and conductive lines 125) in the dielectric layer 121.Various embodiments of the memory devices 123 in FIG. 1, such as memorydevices 200, 200A, and 200B, are discussed hereinafter in details.

FIG. 1 further illustrates a second layer of memory devices 123B formedover the memory devices 123A. The memory devices 123A and 123B may havea same or similar structure, and may be collectively referred to asmemory devices 123, or 3D memory devices 123. The example of FIG. 1illustrates two layers of memory devices 123 as a non-limiting example.Other numbers of layers of memory devices 123, such as one layer, threelayers, or more, are also possible and are fully intended to be includedwithin the scope of the present disclosure. The one or more layers ofmemory device 123 are collective referred to as a memory region 130 ofthe semiconductor device 100, and may be formed in the back-end-of-line(BEOL) processing of semiconductor manufacturing. The memory devices 123may be formed in the BEOL processing at any suitable locations withinthe semiconductor device 100, such as over (e.g., directly over) thefirst region 110, over the second region 120, or over a plurality ofregions.

In the example of FIG. 1, the memory devices 123 occupy some, but notall, of the areas of the memory region 130 of the semiconductor device100, because other features, such as conductive lines 125 and vias 124,may be formed in other areas of the memory region 130 for connection toconductive features over and below the memory region 130. In someembodiments, to form the memory devices 123A or 123B, a mask layer, suchas a patterned photoresist layer, is formed to cover some areas of thememory region 130, while the memory devices 123A or 123B are formed inother areas of the memory region 130 exposed by the mask layer. Afterthe memory devices 123 are formed, the mask layer is then removed.

Still referring to FIG. 1, after the memory region 130 is formed, aninterconnect structure 140, which includes dielectric layer 121 andelectrically conductive features (e.g., vias 124 and conductive lines125) in the dielectric layer 121, is formed over the memory region 130.The interconnect structure 140 may electrically connect the electricalcomponents formed in/on the substrate 101 to form functional circuits.The interconnect structure 140 may also electrically couple the memorydevices 123 to the components formed in/on the substrate 101, and/orcouple the memory devices 123 to conductive pads formed over theinterconnect structure 140 for connection with an external circuit or anexternal device. Formation of interconnect structure is known in theart, thus details are not repeated here.

In some embodiments, the memory devices 123 are electrically coupled tothe electrical components (e.g., transistors) formed on the substrate50, e.g., by the vias 124 and conductive lines 125, and are controlledor accessed (e.g., written to or read from) by functional circuits ofthe semiconductor device 100, in some embodiments. In addition, oralternatively, the memory devices 123 are electrically coupled toconductive pads formed over a top metal layer of the interconnectstructure 140, in which case the memory devices 123 may be controlled oraccessed by an external circuit (e.g., another semiconductor device)directly without involvement of the functional circuits of thesemiconductor device 100, in some embodiments. Although additional metallayers (e.g., the interconnect structure 140) are formed over the memorydevices 123 in the example of FIG. 1, the memory devices 123 may beformed in a top (e.g., topmost) metal layer of the semiconductor device100, these and other variations are fully intended to be included withinthe scope of the present disclosure.

FIGS. 2-9, 10A, 10B, 10D, 10E, 10F, 10G, 10H, 11, and 12 illustratevarious views (e.g., perspective view, cross-sectional view) of athree-dimensional (3D) memory device 200 at various stages ofmanufacturing, in an embodiment. The 3D memory device 200 is athree-dimensional memory device with a ferroelectric material, and maybe, e.g., a 3D NOR-type memory device. The 3D memory device 200 may beused as the memory device 123A and 123B in FIG. 1. Note that forsimplicity, not all features of the 3D memory device 200 are illustratedin the figures.

Referring now to FIG. 2, which shows a perspective view of the memorydevice 200 at an early stage of fabrication. As illustrated in FIG. 2,layer stacks 202A, 202B, and 202C are formed successively over thesubstrate 101 (not illustrated in FIG. 2 but illustrated in FIG. 1). Thelayer stacks 202A, 202B, and 202C may be collectively referred to aslayer stacks 202 herein. The layer stacks 202A, 202B, and 202C have asame layered structure, in the illustrated embodiments. For example,each of the layer stacks 202 includes a dielectric layer 201, a channellayer 203 over the dielectric layer 201, and a source/drain layer 205over the channel layer 203.

In some embodiments, to form the layer stack 202A, the dielectric layer201 is formed by depositing a suitable dielectric material, such assilicon oxide, silicon nitride, or the like, over the substrate 101 (seeFIG. 1) using a suitable deposition method, such as PVD, CVD, atomiclayer deposition (ALD), or the like. Next, the channel layer 203 isformed over the dielectric layer 201. In some embodiments, the channellayer 203 is formed of a suitable channel material, such as asemiconductor material. Examples of the semiconductor material includeamorphous-silicon (a-Si), polysilicon (poly-Si), or the like. In someembodiments, the channel layer 203 is an oxide semiconductor (may alsobe referred to as a semiconductive oxide), such as indium gallium zincoxide (IGZO), zinc oxide (ZnO), indium tungsten oxide (IWO), or thelike. The channel layer 203 may be formed by, e.g., PVD, CVD, ALD,combinations thereof, or the like. Next, the source/drain layer 205 isformed over the channel layer 203. In some embodiments, the source/drainmetal layer 205 is formed of a metal or a metal-containing material suchas Al, Ti, TiN, W, Mo, or indium tin oxide (ITO), using a suitableformation method, such as PVD, CVD, ALD, sputtering, plating, or thelike. Therefore, the source/drain layer 205 may also be referred to as asource/drain metal layer 205.

In some embodiments, depending on the type (e.g., N-type or P-type) ofdevice formed, the source/drain metal layer 205 may be formed of anN-type metal or a P-type metal. In some embodiments, Sc, Ti, Cr, Ni, Al,or the like, is used as the N-type metal for forming the source/drainmetal layer 205. In some embodiments, Nb, Pd, Pt, Au, or the like, isused as the P-type metal for forming the source/drain metal layer 205.The N-type or P-type metal layer may be formed of a suitable formationmethod such as PVD, CVD, ALD, sputtering, plating, or the like.

After the layer stack 202A is formed, the process to form the layerstack 202A may be repeated to form the layer stacks 202B and 202Csuccessively over the layer stack 202A, as illustrated in FIG. 1. Afterthe layer stacks 202A, 202B, and 202C are formed, a dielectric layer201T is formed over the layer stack 202C. In the illustrated embodiment,the dielectric layer 201T is formed of a same dielectric material as thedielectric layer 201 in the layer stacks 202, thus may also be referredto as a dielectric layer 201 in subsequent discussion.

Next, in FIG. 3, openings 207 are formed that extend through the layerstacks 202A, 202B, 202C and the dielectric layer 201 over the layerstack 202C. The openings 207 may be formed using photolithography andetching techniques. The openings 207 includes first openings 207A, whichare formed within boundaries (e.g., perimeters, or sidewalls) of thelayer stacks 202, such that each of the first openings 207A issurrounded (e.g., encircled) by the layer stacks 202. The openings 207also include a second opening 207B, which extends to a perimeter (e.g.,a sidewall) of the layer stacks 202. In other words, the second opening207B is not completely surrounded by the layer stacks 202. Instead, thesecond opening 207B is partially surrounded by the layer stacks 202. Theopening 207B in FIG. 3 is illustrated as a shallow opening (e.g.,extending a shallow depth from the sidewall of the layer stack 202toward the opening 207A) in order to clearly show features formed insidethe opening 207B, the opening 207B may be deeper (see, e.g., FIG. 9)than illustrated. In the example of FIG. 3, each of the first openings207A has a rectangular shaped top view and four sidewalls, and thesecond opening 207B has a U-shaped top view and three sidewalls. In FIG.3, the openings 207 are aligned in a column, and adjacent openings 207are separated by a distance W1. In some embodiments, the distance W1 isbetween about 10 nm and about 50 nm.

Next, in FIG. 4, portions of the source/drain layers 205 exposed by(e.g., facing) the openings 207 are removed to form recesses 209. Forexample, an isotropic etching process using an etchant selective to(e.g., having a higher etching rate for) the material of thesource/drain layers 205 may be used to remove portions of thesource/drain layers 205 facing the openings 207, such that thesource/drain layers 205 are laterally recessed from the sidewalls of theopenings 207 without substantially attacking other materials. In someembodiments, the etchant used in the isotropic etching process is SC1solution, which is a mixture of deionized water, NH₃, and H₂O₂. A widthW2 of the recess 209, measured between the locations of the sidewall ofthe source/drain layer 205 before and after the recessing of thesource/drain layers 205, is between about 1 nm and about 5 nm. In theillustrated embodiment, the width W2 is larger than or equal to half ofW1 (e.g., W2≥0.5×W1). Since the source/drain layers 205 are laterallyrecessed from the sidewalls of the openings 207 in all directions, andsince W2 is larger than or equal to half of W1, the portions of thesource/drain layers 205 between adjacent openings 207 are completelyremoved. As a result, the subsequently formed inner spacer layer 211(see FIG. 10G) completely fills the spaces between adjacent openings 207(or equivalently, between the subsequently formed ferroelectric material213 along sidewalls of the openings 207).

Note that in the discussion herein, a sidewall of the layer stack 202A,202B, or 202C includes the corresponding sidewalls of all theconstituent layers (e.g., 201, 203, and 205) of that layer stack. Forexample, a sidewall of the layer stack 202A exposed by the opening 207includes the corresponding sidewall of the dielectric layer 201, thecorresponding sidewall of the channel layer 203, and the correspondingsidewall of the source/drain layer 205 that are exposed by the opening207. In the illustrated embodiment, before the recessing of thesource/drain layer 205, the corresponding sidewalls of the constituentlayers (e.g., 201, 203, and 205) of the layer stacks 202 are alignedalong a same vertical plane. After recessing of the source/drain layer205 to form the recesses 209, the corresponding sidewalls of thedielectric layer 201 and the channel layer 203 of the layer stacks 202are aligned along a same vertical plane, in the illustrated embodiment.

Next, in FIG. 5, an inner spacer layer 211 is formed (e.g., conformallyformed) in the openings 207 to line sidewalls and bottoms of theopenings 207. The inner spacer layer 211 may also be formed over theupper surface of the topmost dielectric layer 201 in FIG. 5. The innerspacer layer 211 is formed of a suitable dielectric material, such assilicon nitride (SiN), silicon carbon nitride (SiCN), silicon carbonoxynitride (SiCON), or the like, using a suitable method such as CVD,PVD, ALD, or the like. A thickness of the inner spacer layer 211 may bebetween about 1 nm and about 5 nm, as an example. The inner spacer layer211 fills the recesses 209, as illustrated in FIG. 5.

Next, in FIG. 6, portions of the inner spacer layer 211 along thesidewalls of the openings 207 and the bottoms of the openings 207 areremoved, e.g., by an anisotropic etching process such as plasma etching.The anisotropic etching process is performed to remove portions of theinner spacer layer 211 from the sidewalls and the bottoms of theopenings 207, and to remove the inner spacer layer 211 from the uppersurface of the topmost dielectric layer 201 (if formed). After theanisotropic etching process, the inner spacer layer 211 in the recesses209 remain, and may also be referred to as inner spacers 211. In theexample of FIG. 6, sidewalls of the inner spacers 211 facing theopenings 207 are aligned with respective sidewalls of the dielectriclayers 201 and respective sidewalls of the channel layers 203. The innerspacers 211 may advantageously lower the parasitic capacitance of thedevice formed, in some embodiments.

Next, in FIG. 7, a ferroelectric material 213 is formed (e.g.,conformally formed) in the openings 207 to line the sidewalls and thebottoms of the openings 207. The ferroelectric material 213 may also beformed over the upper surface of the topmost dielectric layer 201 inFIG. 7. The ferroelectric material 213 is hafnium oxide (HfO₂) doped byAl, Si, Zr, La, Gd, or Y, in an embodiment. In some embodiments, aferroelectric material, such as HZO, HSO, HfSiO, HfLaO, HfZrO₂, or ZrO₂,is used as the ferroelectric material 213. A suitable formation method,such as PVD, CVD, ALD, or the like, may be used to form theferroelectric material 213. Next, an anisotropic etching process may beperformed to remove the ferroelectric material 213 from the uppersurface of the topmost dielectric layer 201 (if formed) and from thebottoms of the openings 207.

Next, in FIG. 8, an electrical conductive material (also referred to asa gate material, or a gate metal), such as Al, W, Mo, TiN, TaN,combinations thereof, or multilayers thereof, is formed to fill theopenings 207. The gate material may be formed by a suitable method, suchas PVD, CVD, ALD, plating, or the like. After the gate material isformed, a planarization process, such as a chemical mechanicalplanarization (CMP), may be performed to remove excess portions of thegate material from the upper surface of the topmost dielectric layer201, and the remaining portions of the gate material in the openings 207form gate electrodes 212 (e.g., 212A and 212B). The gate electrodes 212include first gate electrodes 212A formed in the first openings 207A(see FIG. 3), and a second gate electrode 212B formed in the secondopening 207B. In subsequent processing, the second gate electrode 212Bis removed, and therefore, the second gate electrode 212B is alsoreferred to as a dummy gate electrode.

Next, in FIG. 9, openings 217 (e.g., 217A and 217B) are formed thatextend through the topmost dielectric layer 201 and the layer stacks202. The openings 217 may be formed using photolithography and etchingtechniques. The openings 217 includes trenches 217A (may also bereferred to as slot-shaped openings 271A) formed in the first gateelectrodes 212A, and a recess 217B formed at locations of the secondgate electrode 212B (see FIG. 8) and the ferroelectric material 213around the second gate electrode 212B. In other words, forming therecess 217B removes the second gate electrode 212B of FIG. 8 and theferroelectric material 213 around the second gate electrode 212B. Therecess 217B in FIG. 9 extends from a sidewall of the layer stacks 202toward the gate electrodes.

Note that each of the trenches 217A bisects (e.g., cuts or separatesinto two separate portions) a respective first gate electrode 212A intotwo separate gate electrodes 215 (which are also referred to as a pairof gate electrodes 215). Therefore, the number of gate electrodes 215 istwice that of the first gate electrodes 212A. In addition, each of thetrenches 217A also bisects the ferroelectric material 213 around each ofthe first gate electrodes 212A. Note that in the example of FIG. 9, thetrenches 217A stop at the outer sidewalls 213S1 and 213S2 of theferroelectric material 213. The recess 217B has a width W3 betweenopposing sidewalls of the recess 217B. The width W3 may be between,e.g., 50 nm and about 150 nm, as an example. In the example of FIG. 9,the openings 217 are aligned in a row, such that the opposing sidewallsof the recess 217B are aligned with respective opposing sidewalls of thetrenches 217A, which are aligned with the outer sidewalls 213S1/213S2 ofthe ferroelectric material 213.

Next, in FIG. 10A, a dielectric material 219 is formed to fill theopenings 217. The dielectric material 219 may be, e.g., silicon oxide,silicon nitride, or the like, formed by a suitable method such as CVD,PVD, ALD, or the like. A planarization process, such as CMP, may beperformed to remove excess portions of the dielectric material 219 fromthe upper surface of the topmost dielectric layer 201. The dielectricmaterial 219 thus form isolation regions that electrically isolate eachpair of gate electrodes 215 from each other.

FIG. 10B illustrates a perspective view of a portion of the memorydevice 200 of FIG. 10A. In particular, FIG. 10B illustrates a cut-outportion of the memory device 200 within the dashed box 220 in FIG. 10A.For simplicity, only portions of the memory device 200 located at thesame levels (e.g., distance from the substrate 101) as the layers of thelayer stacks 202C are illustrated in FIG. 10B.

As illustrated in FIG. 10B, the dielectric material 219 cuts each of thefirst gate electrodes 212A (see FIG. 8) into a pair of gate electrodes215. The ferroelectric material 213 extends along sidewalls of the gateelectrodes 215, and is disposed between the gate electrode 215 and arespective channel layer 203. The dashed lines 221 in FIG. 10Billustrate the channel regions formed in the channel layers 203 duringoperation of the 3D memory device 200, e.g., when a gate voltage isapplied at the gate electrode 215. The arrows 216 in FIG. 10B illustrateexample electrical current flow directions between source/drain regions(see 205A/205B in FIG. 10G), which are outside of (e.g., in front of andbehind) the cut-out portion of FIG. 10B.

FIG. 10C illustrates switching of the electrical polarization directionof the ferroelectric material 213 of the three-dimensional memory device200. Three layers of different materials (e.g., 215, 213, and 203)within the dashed box 218 of FIG. 10B are illustrated on the left sideof FIG. 1C. FIG. 10C shows that when the direction of an electricalfield (E-field) applied to the ferroelectric material 213 is switched,the electric polarization direction of the ferroelectric material 213switches accordingly, as illustrated in FIG. 1C. For example, anelectrical field may be applied to the ferroelectric material 213 inFIG. 10C by applying a voltage between the gate electrode 215 and arespective source/drain layer 205 that is electrically coupled to (e.g.,over and contacting) the channel layer 203 in FIG. 1C. For example, avoltage may be applied to a source/drain region 205 in thestaircase-shaped region (see, e.g., FIG. 12) of the 3D memory device 200through source/drain contact 227.

FIGS. 10D and 10E illustrate cross-sectional views of the 3D memorydevice 200 of FIG. 10A along cross-sections A-A and B-B, respectively.FIG. 10D shows the layer stacks 202A, 202B, and 202C, as well as thetopmost dielectric layer 201. FIG. 10E shows the cross-sectional view ofthe 3D memory device 200 along cross-section B-B. In FIG. 10E, each pairof gate electrodes 215 are separated by the dielectric material 291 inbetween. The ferroelectric material 213 extends along sidewalls of thegate electrodes 215.

Note that in the cross-sectional view of FIG. 10E, the source/drainlayer 205 in each of the layer stacks 202 is replaced by the innerspacers 211. As illustrated in FIG. 10E, the inner spacers 211 fill thespace between the ferroelectric material 213 disposed along sidewalls ofadjacent gate electrodes 215, and has a width W1. In other words, nosource/drain layer 205 is visible in the cross-sectional view of FIG.10E. Recall that the width W2 (see FIG. 4) of the recess 209 is largerthan or equal to half of the distance W1 between adjacent openings 207.As a result, the inner spacers 211 fill the recesses 209 and completelyfill the spaces between adjacent openings 207. Note that the sidewallsof the ferroelectric material 213 facing the inner spacers 211 in FIG.10E are at the same locations as the sidewalls of the openings 207before the recesses 209 are formed.

The dashed lines 221 in FIG. 10E (also illustrated in FIG. 10B)illustrates the channel regions formed during operation of the 3D memorydevice 200. The electrical current flows in and out of the paper alongthe channel regions in the cross-sectional view of FIG. 10E. FIG. 10Efurther illustrate a plurality of memory cells 223, where each memorycell 223 includes portions of the various layers/materials within thearea of the memory cells 223. For example, each memory cell 223 includes(portions of) the gate electrode 215, the ferroelectric material 213,the inner spacer 211, the dielectric layer 201, the channel layer 203,and source/drain regions 205A/205B (see FIG. 10G). Therefore, eachmemory cell 223 is a transistor with the ferroelectric material 213between the gate electrode 215 and the channel layer 203 (see FIG. 10F).Note that to avoid clutter, FIG. 10E only shows dashed boxes around twomemory cells 223 of the 3D memory device 200, and dashed boxes are notshown around other memory cells of the 3D memory device 200.

FIG. 10F illustrates a cross-sectional view of the 3D memory device 200of FIG. 10A along cross-sectional E-E. The cross-section E-E is along ahorizontal plane that cuts across the channel layer 203. As illustratedin FIG. 10F, each pair of gate electrodes 215 contact and extend alongopposing sidewalls of the dielectric material 219 disposed in between.The ferroelectric material 213 extends along sidewalls (e.g., threesidewalls) of the gate electrode 215, and is disposed between the gateelectrodes 215 and the channel layer 203. Sidewalls of the ferroelectricmaterial 213 are aligned with respective sidewalls of the dielectricmaterial 219, such that a width of the ferroelectric material 213 inFIG. 10F, measured along the horizontal direction of FIG. 10F, is thesame as a width of the dielectric material 219 measured along the samehorizontal direction. In addition, FIG. 10F shows dashed boxes aroundtwo of the memory cells 223, and the dashed lines 221 shows the channelregions in two of the memory cells.

FIG. 10G illustrates a cross-sectional view of the 3D memory device 200of FIG. 10A along cross-sectional D-D. The cross-section D-D is along ahorizontal plane that cuts across the source/drain layer 205. Asillustrated in FIG. 10G, the inner spacer layer 211, which is acontinuous region in the cross-sectional view of FIG. 10G, completelyfills the spaces between portions of the ferroelectric material 213along adjacent gate electrodes 215, and also fills the space between thelowermost portion 219B of the dielectric material 219 and the lowermostportion of the ferroelectric material 213 in FIG. 10G. As a result, theinner spacer layer 211 separates the source/drain layer 205 into twoseparate (e.g., spaced apart) source/drain regions 205A and 205B.

When the transistor of a memory cell 223 is turned on and a voltage isapplied between the source/drain regions 205A and 205B, electricalcurrent flows between the source/drain regions 205A/205B. For example,referring to FIGS. 10A, 10B, 10E, 1° F., and 10G, the electrical currentmay flow downward from the source/drain region 205A (see FIGS. 10A and10G) to an underlying portion of the channel layer 203 (see FIGS. 10Aand 10F), then flow horizontally along channel region 221 (see FIG. 10F)to a portion of the channel layer 203 under the source/drain region 205B(see FIG. 10G), then flow upward to the source/drain region 205B. Notethat in the description of current flow above, the directions“downward,” “upward,” “horizontal” are relative to the orientationillustrated in FIG. 10A.

FIG. 10H illustrates a cross-sectional view of the 3D memory device 200of FIG. 10A along cross-sectional C-C. The cross-section C-C is along ahorizontal plane that cuts across the dielectric layer 201.

Next, in FIG. 11, a staircase-shaped contact region is formed in the 3Dmemory device 200, so that a portion of the source/drain layer 205 ofeach of the layer stacks 202 is exposed. The staircase-shaped contactregion may be formed by a plurality of etching processes, where each ofthe etching processes is performed by using a different etching mask toexpose a different portion of the 3D memory device 200 for removal, andby etching for a different duration to achieve different etching depth,as an example. The un-etched portion of the 3D memory device 200, whichincludes the gate electrodes 215 and the ferroelectric material 213around the gate electrodes 215, form the memory cell array of the 3Dmemory device 200.

As illustrated in FIG. 11, a portion of each of the layer stacks 202laterally distal from the memory cell array is removed to form thestaircase-shaped contact region. The areas of the removed portion of thelayer stack 202 increase along a vertical direction away from thesubstrate 101 (see FIG. 1). In other words, the higher (further awayfrom the substrate 101) is the layer stack 202 (e.g., 202A, 202B, or202C), the more areas of the layer stack are removed. Note that thesource/drain layer 205 in each of the layer stacks 202 is separated intotwo separate source/drain regions 205A and 205B that are disposed onopposing sides of the dielectric material 219.

Next, in FIG. 12, gate contacts 225 are formed over and electricallycoupled to the gate electrodes 215, source/drain contacts 227 (e.g.,227A, 227B, and 227C) are formed over and electrically coupled to thesource/drain regions 205A, and source/drain contacts 229 (e.g., 229A,229B, and 229C) are formed over and electrically coupled to thesource/drain regions 205B. In the context of memory device, each of thegate contacts 225 may also be referred to as a word line (WL), each ofthe source/drain contacts 227 may also be referred to as a source line(SL), and each of the source/drain contacts 229 may also be referred toas a bit line (BL). The gate contacts 225 and the source/drain contacts227/229 may be formed by forming a dielectric layer (not shown) over thestructure of FIG. 11, forming openings in the dielectric layer atlocations corresponding to the gate contacts 225 and the source/draincontacts 227/229, where the openings expose the underlying conductivefeature (e.g., gate electrodes 215, or the source/drain regions205A/205B), and filling the openings with an electrically conductivematerial, such as Cu, W, Au, Ag, Co, Ti, Ta, TaN, TiN, combinationsthereof, multilayers thereof, or the like. In some embodiments, theopenings in the dielectric layer (not shown) for forming thesource/drain contacts 227/229 are formed by etching the dielectric layerusing an etchant selective to (e.g., having a higher etching rate for)the material of the dielectric layer. The selective etching may beperformed until all the contact openings in the staircase-shaped contactregion are formed. Therefore, the source/drain regions 205A/205B inhigher layer stacks (e.g., 202C) underlying the contact openings may beexposed to the etchant for a longer period of time than the source/drainregions 205A/205B in lower layer stacks (e.g., 202B, or 202A) underlyingthe contact openings. As a result, a thickness of the portions of thesource/drain regions 205A/205B directly under (e.g., contacting) thesource/drain contacts 227/229 in a higher layer stack (e.g., 202C) maybe smaller than that in a lower layer stack (e.g., 202B or 202A), whileportions of the source/drain regions 205A/205B outside the lateralextents (e.g., beyond sidewalls) of the source/drain contact 227/229 inall layer stacks (e.g., 202A, 202B, and 202C) may have a same thickness.

As illustrated in FIG. 12, due to different upper surfaces of thesource/drain layers 205 of the layer stacks 202 being at differentvertical levels (e.g., distances from the substrate 101), lower surfacesof the source/drain contacts 227 (or 229) on different layer stacks 202are also at different vertical levels. For example, the lower surfacesof the source/drain contacts 227 (or 229) on the layer stack 202A arecloser to the substrate 101 than the lower surfaces of the source/draincontacts 227 (or 229) on the layer stacks 202B/202C.

In the example of FIG. 12, six gate electrodes 215 are shown. Each ofthe gate electrodes 215 and the source/drain contacts 227/229 coupled tothe source/drain regions 205A/205B at a same vertical level define thethree terminals of a memory cell (e.g., a transistor with ferroelectricmaterial 213). Therefore, in the example of FIG. 12, the six gateelectrodes 215 and the three pairs of source/drain contacts 227/229 forma total of 18 memory cells.

Referring to FIG. 12 and FIGS. 10E-10G, to perform a write operation ona particular memory cell, e.g., the memory cell 223 in FIG. 10E, a writevoltage is applied across a portion of the ferroelectric material 213within the memory cell 223. The write voltage may be applied, forexample, by applying a first voltage to the gate electrode 215 of thememory cell 223 (through the gate contact 225), and applying a secondvoltage to the source/drain regions 205A/205B (through source/draincontacts 227/229). The voltage difference between the first voltage andthe second voltage sets the polarization direction of the ferroelectricmaterial 213. Depending on the polarization direction of theferroelectric material 213, the threshold voltage VT of thecorresponding transistor of the memory cell 223 can be switched from alow threshold voltage VL to a high threshold voltage VH, or vice versa.The threshold voltage value (VL or VH) of the transistor can be used toindicate a bit of “0” or a “1” stored in the memory cell.

To perform a read operation on the memory cell 223, a read voltage,which is a voltage between the low threshold voltage VL and the highthreshold voltage VH, is applied to the transistor, e.g., between thegate electrode 215 and the source/drain region 205A. Depending on thepolarization direction of the ferroelectric material 213 (or thethreshold voltage of the transistor), the transistor of the memory cells223 may or may not be turned on. As a result, when a voltage is applied,e.g., at the source/drain region 205B, an electrical current may or maynot flow between the source/drain regions 205A and 205B. The electricalcurrent may thus be detected to determine the digital bit stored in thememory cell.

FIG. 13 illustrates a perspective view of a three-dimensional (3D)memory device 200A, in another embodiment. The 3D memory device 200A issimilar to the 3D memory device 200 of FIG. 12, but with the gatecontacts 225 formed under the layer stack 202A. Since the gateelectrodes 215 extend through the layer stacks 202, lower surfaces ofthe gate electrodes are exposed at the lower surface of the layer stack202. Therefore, forming gate contacts 225 under the gate electrodes 215may be easily achieved. For example, before forming the layer stack 202Ain FIG. 2, a metal layer may be formed over the dielectric layer 119 inFIG. 1 to form metal features (e.g., 225) at locations over which thegate electrodes 215 are formed in subsequent processing. In subsequentprocess, once formed, the gate electrodes 215 will be electricallycoupled to the gate contacts 225 in the metal layer.

FIG. 13 further illustrates transistors 231 and vias 233 thatelectrically couple the gate contacts 225 to the transistors 231. Thetransistors 231 and vias 233 are part of the semiconductor device 100 ofFIG. 1 and not part of the 3D memory device 200A, in the illustratedembodiment. The transistors 231 may be the FinFETs formed over thesubstrate 101 of FIG. 1, and the vias 233 may be formed under the 3Dmemory device 200A to electrically couple to the FinFETs.

FIG. 14 illustrates a perspective view of a three-dimensional (3D)memory device 200B, in yet another embodiment. The 3D memory device 200Bis similar to the 3D memory device 200 of FIG. 12, but with the memorycell array formed in the middle region of the 3D memory device 200B, andwith two staircase-shaped contact regions formed on opposing sides ofthe memory cell array. The 3D memory device 200B may be formed bymodifying the fabrication process for the 3D memory device 200. Forexample, in the process step of FIG. 3, two second openings 207B areformed on opposing sides of the first openings 207A. The rest of theprocessing steps are similar to those for the 3D memory device 200, thusdetails are not repeated.

FIG. 15 illustrates an equivalent circuit diagram 300 of athree-dimensional memory device, in an embodiment. The circuit diagram300 corresponds to a portion of the 3D memory device 200, 200A, or 200B,in an embodiment. Memory cells in the circuit diagram 300 areillustrated as transistors with terminals labeled as SL, BL, and WL(e.g., WL1A, WL1B, WL2A, or WL2B), where terminals SL, BL, and WLcorrespond to the gate contacts 225, the source/drain contacts 227, andthe source/drain contacts 229, respectively. Three layers of memorycells are illustrated in FIG. 15, which corresponds to the memory cellsformed in the three layer stacks 202 in FIGS. 12, 13, and 14. The WLsextend vertically to electrically connect the memory cells implementedin different layer stacks 202.

Variations and modifications to the disclosed embodiments are possibleand are fully intended to be included within the scope of the presentdisclosure. For example, three layer stacks 202 (e.g., 202A, 202B, and202C) are illustrated in the 3D memory devices 200, 200A, and 200B as anon-limiting example. The number of layer stacks 202 in the 3D memorydevice can be any suitable number, such as one, two, or more than three,as skilled artisan readily appreciate. In addition, the top view of theopenings 207 are illustrated as rectangles or squares, other shapes forthe openings 207 (thus other shapes for the gate electrodes 215), suchas circle, oval, or polygon, may also be used.

Embodiments may achieve advantages. The disclosed 3D memory devices canbe easily integrated into existing semiconductor devices during the BEOLprocessing. The areas under the 3D memory devices can still be used toform various circuits, such as logic circuits, I/O circuits, or ESDcircuits during the FEOL processing. Therefore, besides the peripheralcircuits (e.g., decoders, amplifiers) and routing circuits used for the3D memory devices, there is little penalty in terms of foot print forimplementing the disclosed 3D memory devices. In addition, the disclosed3D memory devices have highly efficient structures to reduce its memorycell size. For example, the BL and SL coupled to the source/drain layer205 of a layer stack are shared by all the memory cells formed withinthe same layer stack. The WL is connected to the gate electrode 215which extends through all the layer stacks 202, and therefore, the WL isalso shared by vertically aligned memory cells formed in different layerstacks. By cutting the first gate electrode 212A into a pair of gateelectrodes 215, the number of memory cells in the 3D memory device iseasily doubled. As discussed above, the disclosed 3D memory devices havestructures that can be scaled easily to allow for high-density memoryarrays to be formed, which is important for emerging applications suchas Internet of Things (IoT) and machine learning. By integrating the 3Dmemory arrays on chip during the BEOL processing, issues such as energyconsumption bottleneck due to off-chip memory access are avoided. As aresult, semiconductor devices with the disclosed 3D memory devicesintegrated may be made smaller, cheaper, while operating at faster speedand consuming less power. Additional advantage may include reducedparasitic capacitance by the formation of the inner spacers.

FIG. 16 illustrates a flow chart of a method of forming a memory device,in some embodiments. It should be understood that the embodiment methodshown in FIG. 16 is merely an example of many possible embodimentmethods. One of ordinary skill in the art would recognize manyvariations, alternatives, and modifications. For example, various stepsas illustrated in FIG. 16 may be added, removed, replaced, rearranged,or repeated.

Referring to FIG. 16, at block 1010, a first layer stack and a secondlayer stack are formed successively over a substrate, wherein the firstlayer stack and the second layer stack have a same structure thatcomprises a dielectric layer, a channel layer, and a source/drain layerformed successively over the substrate. At block 1020, a plurality ofopenings are formed that extend through the first layer stack and thesecond layer stack, wherein the plurality of openings comprise: firstopenings within boundaries of the first layer stack and the second layerstack; and a second opening extending from a sidewall of the secondlayer stack toward the first openings. At block 1030, inner spacers areformed by replacing portions of the source/drain layer exposed by theopenings with a first dielectric material. At block 1040, sidewalls ofthe openings are lined with a ferroelectric material. At block 1050,first gate electrodes are formed in the first openings and a dummy gateelectrode is formed in the second opening by filling the openings withan electrically conductive material.

In accordance with an embodiment, a method for forming a memory deviceincludes: forming a first layer stack over a substrate, the first layerstack comprising a first dielectric layer, a first channel layer, and afirst source/drain layer formed successively over the substrate; forminga second layer stack over the first layer stack, the second layer stackcomprising a second dielectric layer, a second channel layer, and asecond source/drain layer formed successively over the first layerstack; forming openings that extend through the first layer stack andthe second layer stack, wherein first ones of the openings are encircledby the first layer stack, and a second one of the openings extends to afirst sidewall of the first layer stack; replacing a first portion ofthe first source/drain layer and a second portion of the secondsource/drain layer exposed by the openings with a first dielectricmaterial; after the replacing, lining sidewalls of the openings with aferroelectric material; after lining the sidewalls of the openings,filling the openings with an electrically conductive material to formfirst gate electrodes in the first ones of the openings and to form asecond gate electrode in the second one of the openings; after fillingthe openings, forming trenches and a recess that extend through thefirst layer stack and the second layer stack, wherein the trenchesbisect the first gate electrodes, wherein forming the recess removes thesecond gate electrode and the ferroelectric material around the secondgate electrode; and filling the trenches and the recess with a seconddielectric material. In an embodiment, replacing the first portion ofthe first source/drain layer and the second portion of the secondsource/drain layer comprises: performing an etching process to removethe first portion of the first source/drain layer and the second portionof the second source/drain layer that are exposed by the openings; afterperforming the etching process, depositing the first dielectric materialin the openings, wherein the first dielectric material lines thesidewalls and bottoms of the openings, and fills spaces left by theremoved first portion of the first source/drain layer and by the removedsecond portion of the second source/drain layer; and performing ananisotropic etching process to remove the first dielectric material fromthe sidewalls and the bottoms of the openings. In an embodiment, afterreplacing the first portion of the first source/drain layer and thesecond portion of the second source/drain layer, the first dielectricmaterial fills spaces between the first ones of the openings, separatesthe first source/drain layer into a first source/drain region and asecond source/drain region spaced apart from the first source/drainregion, and separates the second source/drain layer into a thirdsource/drain region and a fourth source/drain region spaced apart fromthe third source/drain region. In an embodiment, the trenches are formedto further bisect the ferroelectric material around the first gateelectrodes. In an embodiment, the recess is formed to extend from thefirst sidewall of the first layer stack toward the first gateelectrodes, wherein sidewalls of the recess form a U-shape. In anembodiment, each of the first gate electrodes is electrically isolatedby the second dielectric material into two separate second gateelectrodes, wherein the method further comprises, after filling thetrenches and the recess: forming gate contacts electrically coupled tothe second gate electrodes; and forming source/drain contactselectrically coupled to the first source/drain layer and the secondsource/drain layer. In an embodiment, the gate contacts are formed overthe second layer stack such that the second layer stack is between thegate contacts and the first layer stack. In an embodiment, the gatecontacts are formed under the first layer stack such that the gatecontacts are between the first layer stack and the substrate. In anembodiment, forming the source/drain contacts comprises: removing aportion of the second layer stack laterally distal from the second gateelectrodes to expose an upper surface of the first source/drain layer ofthe first layer stack, wherein the first layer stack and the secondlayer stack form a staircase-shaped region after removing the portion ofthe second layer stack; and forming first source/drain contacts over andelectrically coupled to the exposed upper surface of the firstsource/drain layer. In an embodiment, the method further includesforming a third dielectric layer over the second layer stack beforeforming the openings, wherein the openings are formed to extend throughthe third dielectric layer. In an embodiment, forming the source/draincontacts further comprises: removing a portion of the third dielectriclayer laterally distal from the second gate electrodes to expose thesecond source/drain layer of the second layer stack; and forming secondsource/drain contacts over and electrically coupled to the exposedsecond source/drain layer. In an embodiment, the first source/drainlayer and the second source/drain layer are formed of a first material,and the first channel layer and the second channel layer are formed of asecond material. In an embodiment, the first material is a metal, andthe second material is a semiconductive oxide.

In accordance with an embodiment, a method for forming a memory deviceincludes: forming a first layer stack and a second layer stacksuccessively over a substrate, wherein the first layer stack and thesecond layer stack have a same structure that comprises a dielectriclayer, a channel layer, and a source/drain layer formed successivelyover the substrate; forming a plurality of openings that extend throughthe first layer stack and the second layer stack, wherein the pluralityof openings comprise: first openings within boundaries of the firstlayer stack and the second layer stack; and a second opening extendingfrom a sidewall of the second layer stack toward the first openings;forming inner spacers by replacing portions of the source/drain layerexposed by the openings with a first dielectric material; liningsidewalls of the openings with a ferroelectric material; and formingfirst gate electrodes in the first openings and a dummy gate electrodein the second opening by filling the openings with an electricallyconductive material. In an embodiment, the method further includes,after forming the first gate electrodes and the dummy gate electrode:forming slot-shaped openings extending through the first layer stack andthe second layer stack, the slot-shaped openings bisecting the firstgate electrodes; forming a recess extending from the sidewall of thesecond layer stack toward the first gate electrodes, wherein the dummygate electrode is removed after the recess is formed; and filling theslot-shaped openings and the recess with a second dielectric material.In an embodiment, each of the first gate electrodes is separated by thesecond dielectric material into two gate electrodes to form a pluralityof second gate electrodes, wherein the method further comprising:forming gate contacts electrically coupled to the plurality of secondgate electrodes; removing portions of the second layer stack to exposeportions of the source/drain layer of the first layer stack; and afterremoving the portions of the second layer stack, forming source/draincontacts electrically coupled to the exposed portions of thesource/drain layer of the first layer stack. In an embodiment, thechannel layer is formed of an oxide semiconductor, and the source/drainlayer is formed of a metal.

In accordance with an embodiment, a memory device includes: a layerstack over a substrate, wherein the layer stack comprises a dielectriclayer, a channel layer over the dielectric layer, and a source/drainlayer over the channel layer; a first gate electrode and a second gateelectrode that extend through the layer stack; a dielectric materialextending through the layer stack, wherein a first portion of thedielectric material is between the first gate electrode and the secondgate electrode, a second portion of the dielectric material extends froma sidewall of the layer stack toward the first gate electrode and thesecond gate electrode, and the second portion of the dielectric materialis spaced apart from the first portion of the dielectric material; aferroelectric material extending through the layer stack, wherein theferroelectric material extends along a sidewall of the first gateelectrode and along a sidewall of the second gate electrode; and innerspacers disposed at a same distance from the substrate as thesource/drain layer, wherein the inner spacers surround the first gateelectrode, the second gate electrode, the dielectric material, and theferroelectric material, wherein the inner spacers separate thesource/drain layer into a first source/drain region and a secondsource/drain region spaced apart from the first source/drain region. Inan embodiment, the memory device further includes: gate contactselectrically coupled to the first gate electrode and the second gateelectrode; and source/drain contacts electrically coupled to the firstsource/drain region and the second source/drain region. In anembodiment, the channel layer comprises a semiconductive oxide, and thesource/drain layer comprises a metal.

While this invention has been described with reference to illustrativeembodiments, this description is not intended to be construed in alimiting sense. Various modifications and combinations of theillustrative embodiments, as well as other embodiments of the invention,will be apparent to persons skilled in the art upon reference to thedescription. It is therefore intended that the appended claims encompassany such modifications or embodiments.

1. A method for forming a memory device, the method comprising: forminga first layer stack over a substrate, the first layer stack comprising afirst dielectric layer, a first channel layer, and a first source/drainlayer formed successively over the substrate; forming a second layerstack over the first layer stack, the second layer stack comprising asecond dielectric layer, a second channel layer, and a secondsource/drain layer formed successively over the first layer stack;forming openings that extend through the first layer stack and thesecond layer stack, wherein first ones of the openings are encircled bythe first layer stack, and a second one of the openings extends to afirst sidewall of the first layer stack; replacing a first portion ofthe first source/drain layer and a second portion of the secondsource/drain layer exposed by the openings with a first dielectricmaterial; after the replacing, lining sidewalls of the openings with aferroelectric material; after lining the sidewalls of the openings,filling the openings with an electrically conductive material to formfirst gate electrodes in the first ones of the openings and to form adummy gate electrode in the second one of the openings; after fillingthe openings, forming trenches and a recess that extend through thefirst layer stack and the second layer stack, wherein the trenchesbisect the first gate electrodes, wherein forming the recess removes thedummy gate electrode and the ferroelectric material around the dummygate electrode; and filling the trenches and the recess with a seconddielectric material.
 2. The method of claim 1, wherein replacing thefirst portion of the first source/drain layer and the second portion ofthe second source/drain layer comprises: performing an etching processto remove the first portion of the first source/drain layer and thesecond portion of the second source/drain layer that are exposed by theopenings; after performing the etching process, depositing the firstdielectric material in the openings, wherein the first dielectricmaterial lines the sidewalls and bottoms of the openings, and fillsspaces left by the removed first portion of the first source/drain layerand by the removed second portion of the second source/drain layer; andperforming an anisotropic etching process to remove the first dielectricmaterial from the sidewalls and the bottoms of the openings.
 3. Themethod of claim 1, wherein after replacing the first portion of thefirst source/drain layer and the second portion of the secondsource/drain layer, the first dielectric material fills spaces betweenthe first ones of the openings, separates the first source/drain layerinto a first source/drain region and a second source/drain region spacedapart from the first source/drain region, and separates the secondsource/drain layer into a third source/drain region and a fourthsource/drain region spaced apart from the third source/drain region. 4.The method of claim 1, wherein the trenches are formed to further bisectthe ferroelectric material around the first gate electrodes.
 5. Themethod of claim 4, wherein the recess is formed to extend from the firstsidewall of the first layer stack toward the first gate electrodes,wherein sidewalls of the recess form a U-shape.
 6. The method of claim1, wherein each of the first gate electrodes is electrically isolated bythe second dielectric material into two separate second gate electrodes,wherein the method further comprises, after filling the trenches and therecess: forming gate contacts electrically coupled to the second gateelectrodes; and forming source/drain contacts electrically coupled tothe first source/drain layer and the second source/drain layer.
 7. Themethod of claim 6, wherein the gate contacts are formed over the secondlayer stack such that the second layer stack is between the gatecontacts and the first layer stack.
 8. The method of claim 6, whereinthe gate contacts are formed under the first layer stack such that thegate contacts are between the first layer stack and the substrate. 9.The method of claim 6, wherein forming the source/drain contactscomprises: removing a portion of the second layer stack laterally distalfrom the second gate electrodes to expose an upper surface of the firstsource/drain layer of the first layer stack, wherein the first layerstack and the second layer stack form a staircase-shaped region afterremoving the portion of the second layer stack; and forming firstsource/drain contacts over and electrically coupled to the exposed uppersurface of the first source/drain layer.
 10. The method of claim 9,further comprising forming a third dielectric layer over the secondlayer stack before forming the openings, wherein the openings are formedto extend through the third dielectric layer.
 11. The method of claim10, wherein forming the source/drain contacts further comprises:removing a portion of the third dielectric layer laterally distal fromthe second gate electrodes to expose the second source/drain layer ofthe second layer stack; and forming second source/drain contacts overand electrically coupled to the exposed second source/drain layer. 12.The method of claim 1, wherein the first source/drain layer and thesecond source/drain layer are formed of a first material, and the firstchannel layer and the second channel layer are formed of a secondmaterial.
 13. The method of claim 12, wherein the first material is ametal, and the second material is a semiconductive oxide.
 14. A methodfor forming a memory device, the method comprising: forming a firstlayer stack and a second layer stack successively over a substrate,wherein the first layer stack and the second layer stack have a samestructure that comprises a dielectric layer, a channel layer, and asource/drain layer formed successively over the substrate; forming aplurality of openings that extend through the first layer stack and thesecond layer stack, wherein the plurality of openings comprise: firstopenings within boundaries of the first layer stack and the second layerstack; and a second opening extending from a sidewall of the secondlayer stack toward the first openings; forming inner spacers byreplacing portions of the source/drain layer exposed by the openingswith a first dielectric material; lining sidewalls of the openings witha ferroelectric material; and forming first gate electrodes in the firstopenings and a dummy gate electrode in the second opening by filling theopenings with an electrically conductive material.
 15. The method ofclaim 14, further comprising, after forming the first gate electrodesand the dummy gate electrode: forming slot-shaped openings extendingthrough the first layer stack and the second layer stack, theslot-shaped openings bisecting the first gate electrodes; forming arecess extending from the sidewall of the second layer stack toward thefirst gate electrodes, wherein the dummy gate electrode is removed afterthe recess is formed; and filling the slot-shaped openings and therecess with a second dielectric material.
 16. The method of claim 15,wherein each of the first gate electrodes is separated by the seconddielectric material into two gate electrodes to form a plurality ofsecond gate electrodes, wherein the method further comprising: forminggate contacts electrically coupled to the plurality of second gateelectrodes; removing portions of the second layer stack to exposeportions of the source/drain layer of the first layer stack; and afterremoving the portions of the second layer stack, forming source/draincontacts electrically coupled to the exposed portions of thesource/drain layer of the first layer stack.
 17. The method of claim 14,wherein the channel layer is formed of an oxide semiconductor, and thesource/drain layer is formed of a metal. 18.-20. (canceled)
 21. A methodfor forming a memory device, the method comprising: forming a layerstack over a substrate, wherein the layer stack comprises a dielectriclayer, a channel layer, and a source/drain layer formed successivelyover the substrate; forming first openings that extend through the layerstack; replacing portions of the source/drain layer exposed by the firstopenings with a first dielectric material, wherein the first dielectricmaterial forms inner spacers and separates the source/drain layer intotwo separate portions; lining sidewalls of the first openings with aferroelectric material; and forming first gate electrodes in the firstopenings by filling the first openings with a first electricallyconductive material.
 22. The method of claim 21, further comprising:forming a slot-shaped opening in each of the first gate electrodes,wherein the slot-shaped opening bisects each of the first gateelectrodes into two separate gate electrodes and bisects theferroelectric material; and filling the slot-shaped opening with asecond electrically conductive material.
 23. The method of claim 21,wherein the channel layer is formed of an oxide semiconductor, and thesource/drain layer is formed of a metal.